Height detection of bonding head

The bottom position of the bonding head has to be confirmed as being correct. A contact sensor can be affected by particles and the shifted position may cause detection failure. Various kinds of dies and lead frames have to be contacted at precisely the right position. Settings have to be changed accurately and quickly, regardless of the materials.

A contactless proximity sensor precludes the influence of particles and is maintenance free. Accurate positioning of the bottom point using precise eddy current sensor. One-touch position tuition at separate amplifier makes setting-up easy.

Saves setting-up time and prevents failures due to the faulty positioning.